Case: Hermetically sealed glass package per MIL-. PRF/ DO-7 outline . Lead Material: Copper clad steel. Lead Finish: Tin/Lead. Thermal Resistance. 1N High Conductance Fast Diode. Datasheet: Rev. A ( kB). Product Overview.»View Reliability Data»View Material Composition. 1N • 1N • 1N • 1N • 1N ULTRA FAST LOW CAPACITANCE. DIFFUSED SILICON PLANAR* DIODES. • C pF @ VR -0, f- MHz.

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1N Datasheet(PDF) – National Semiconductor (TI)

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1N3064: High Conductance Fast Diode

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1N High Conductance Fast Diode

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